OSFP to OSFP module form factor adapter

ABSTRACT

An adapter for a communication transceiver is provided. The adapter includes a main body having a first end and opposed second end. The first end of the main body has an OSFP (octal small form factor pluggable) edge connector arranged for electrical and physical connection to an OSFP host connector in an OSFP host port. The main body has a QSFP (quad small form factor pluggable) host connector arranged to receive a QSFP edge connector of a QSFP transceiver through the second end of the main body so that the adapter adapts the QSFP transceiver to an OSFP host. A method of using a communication adapter is also provided.

BACKGROUND

QSFP (quad small form factor pluggable) is a transceiver form factorthat supports high data rates in network communication, presently up to100 G (gigabits per second), as defined in the EIA SFF-8436 (ElectronicIndustries Alliance Small Form Factor 8436) and related publishedstandards. Existing versions of QSFP include QSFP, QSFP+ and QSFP28+.OSFP (octal small form factor pluggable) is proposed as anothertransceiver form factor to support even higher data rates, for exampleup to 400 G. While QSFP and OSFP have physically different form factors,in some environments such as network data centers, there areconfigurations and combinations of new and old hardware, which posecompatibility problems. It is hence desirable to connect between theQSFP form factor and the OSFP form factor, supporting upgrade paths inthese environments without requiring sudden or widespread obsolescenceof equipment. It is within this context that the embodiments arise.

SUMMARY

In some embodiments, an adapter for a communication transceiver isprovided. The adapter includes a main body having a first end andopposed second end. The first end of the main body has an OSFP (octalsmall form factor pluggable) edge connector arranged for electrical andphysical connection to an OSFP host connector in an OSFP host port. Themain body has a QSFP (quad small form factor pluggable) host connectorarranged to receive a QSFP edge connector of a QSFP transceiver throughthe second end of the main body so that the adapter adapts the QSFPtransceiver to an OSFP host.

In some embodiments, an adapter for a communication transceiver and acommunication host is provided. The adapter includes a housing havingopposed first and second ends. The first end of the housing isdimensioned to fit an OSFP (octal small form factor pluggable) host portand the second end of the housing is dimensioned to receive a QSFP (quadsmall form factor pluggable) transceiver so as to have an OSFP hosthaving the OSFP host port cooperate with the QSFP transceiver throughthe adapter.

In some embodiments, a method of using a communication adapter isprovided. The method includes connecting a QSFP (quad small form factorpluggable) to OSFP (octal small form factor pluggable) adapter into anOSFP port in an OSFP host, and connecting a QSFP transceiver into theQSFP to OSFP adapter.

Other aspects and advantages of the embodiments will become apparentfrom the following detailed description taken in conjunction with theaccompanying drawings which illustrate, by way of example, theprinciples of the described embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

The described embodiments and the advantages thereof may best beunderstood by reference to the following description taken inconjunction with the accompanying drawings. These drawings in no waylimit any changes in form and detail that may be made to the describedembodiments by one skilled in the art without departing from the spiritand scope of the described embodiments.

FIG. 1 is a perspective view of an OSFP (octal small form factorpluggable) host, with two OSFP transceivers plugged into the OSFP host,and one QSFP (quad small form factor pluggable) transceiver plugged intoa QSFP to OSFP adapter, which is plugged into the OSFP host, inaccordance with some embodiments.

FIG. 2 is a top view of an example QSFP transceiver in accordance withsome embodiments.

FIG. 3A is a perspective view of an embodiment of the QSFP to OSFPadapter, which receives the QSFP transceiver of FIG. 2 and plugs intothe OSFP host port as shown in FIG. 1 in accordance with someembodiments.

FIG. 3B is a perspective view of the QSFP to OSFP adapter of FIG. 3,with a release in the open position in accordance with some embodiments.

FIG. 4 is a conceptual cross-section view, showing how the QSFPtransceiver fits within the QSFP to OSFP adapter, and the QSFP to OSFPadapter fits within the OSFP host in accordance with some embodiments.

FIG. 5 is a perspective view of the QSFP transceiver of FIG. 2 insertedinto the QSFP to OSFP adapter of FIG. 3A in accordance with someembodiments.

FIG. 6 is a cutaway view of an embodiment of the QSFP to OSFP adapter,showing a flex circuit board flexing to align a QSFP host connector andan OSFP edge connector in accordance with some embodiments.

FIG. 7A is a conceptual cross-section view with exaggerated proportionsshowing a stepped or milled circuit board with a step that aligns a QSFPhost connector and an OSFP edge connector, as an alternative to the flexcircuit board of FIG. 6 in accordance with some embodiments.

FIG. 7B is a conceptual cross-section view with exaggerated proportionsshowing a stepped or milled circuit board that aligns a QSFP hostconnector and an OSFP edge connector, as a further embodimentalternative to the flex circuit board of FIG. 6.

FIG. 8 is a cross-section view with exaggerated proportions of a circuitboard with one or more dummy cores, prepared for milling in accordancewith some embodiments.

FIG. 9 is a cross-section view with exaggerated proportions of thecircuit board of FIG. 8 after milling, as applicable to embodiments of astepped or milled circuit board in accordance with some embodiments.

FIG. 10 is a flow diagram of a method for using a communication adapter,which can be practiced using embodiments of the QSFP to OSFP adapterdisclosed herein in accordance with some embodiments.

FIG. 11A depicts an alternative solution for adaptation usingspecialized modules in accordance with some embodiments.

FIG. 11B depicts an alternative solution for adaptation using aspecialized cable in accordance with some embodiments.

FIG. 11C depicts an alternative solution for adaptation using aspecialized adapter with cable in accordance with some embodiments.

FIG. 11D depicts cable management at a host faceplate, using thealternative solution of FIG. 11C in accordance with some embodiments.

DETAILED DESCRIPTION

A QSFP (quad small form factor pluggable) to OSFP (octal small formfactor pluggable) adapter, described with reference to FIGS. 1-10, andseveral alternatives described with reference to FIGS. 11A-11D, provideconnectivity solutions between the differing form factors of QSFP andOSFP. Of these connectivity solutions, the QSFP to OSFP adapter has anadvantage of supporting various cable formats, including LC (Lucent)optical cable and MPO (multifiber push on) optical cable, and coppercables, thus not requiring custom cables or custom modules specific tocable types. Further, since a host OSFP port can support (lower) QSFPsignal speeds, it is desirable to enable plugging a QSFP module into anOSFP connector (i.e., in the host OSFP port). A solution allowing thissupports a network system that has a number of QSFP modules where it isdesired to upgrade a host to OSFP, so that the QSFP modules andassociated cabling need not be obsoleted.

One embodiment of the QSFP to OSFP adapter has a thin walled structureso that the QSFP transceiver, which is smaller at the front, in heightand width, than an OSFP host port, fits inside of the QSFP to OSFPadapter. According to the QSFP standard, the back of a QSFP transceiver,where cables (e.g., optical or copper) are connected, can be thickerthan the front of the QSFP transceiver. Dimensions and design of theQSFP to OSFP adapter should be such that the adapter can accept any QSFPtransceiver that follows the standard.

In some embodiments, the QSFP to OSFP adapter has a QSFP host connectorat the back for receiving the QSFP transceiver, and also has an OSFPedge connector at the front for connecting to an OSFP host connector,e.g., in an OSFP host. In some embodiments, a QSFP host connectoravailable on the market is used. In various embodiments, a flexiblecircuit board (which could also be termed a flex-rigid board) or astepped or milled circuit board locates the OSFP edge connector at oneheight and the mounting for the QSFP host connector at another height,so that the QSFP host connector and the OSFP edge connector align. Thissupports various QSFP transceivers that have a range of heights orthicknesses within the QSFP standard and can now couple to an OSFP host,with OSFP host ports according to the OSFP standard, through the QSFP toOSFP adapter. Meanwhile, a custom connector can be developed and usedfor this application instead of using flex-rigid board or milled circuitboard can be surely used.

FIG. 1 is a perspective view of an OSFP host 104, with two OSFPtransceivers 108 plugged into the OSFP host 104, and one QSFPtransceiver 106 plugged into a QSFP to OSFP adapter 102, which isplugged into the OSFP host 104, in accordance with some embodiments. TheOSFP host 104 has eight OSFP host ports 110, in this example, each ofwhich can receive an OSFP transceiver 108 or the QSFP to OSFP adapter102. Other hosts with fewer or more ports are readily devised.

FIG. 2 is a top view of an example QSFP transceiver 106 in accordancewith some embodiments. The front end 206 of the QSFP transceiver 106 hasa QSFP edge connector (visible in FIG. 4), and the back 208 of the QSFPtransceiver 106 has cable ports 202 for optical cables, or in someversions, copper cables. This embodiment has a handle 204 at the backend 208 of the QSFP transceiver 106, which encourages removal of theQSFP transceiver 106 by grasping the handle 204 rather than grasping thecables. It should be appreciated that other versions may lack the handle204, which is not required for electrical operation of the transceiver.

FIG. 3A is a perspective view of an embodiment of the QSFP to OSFPadapter 102, which receives the QSFP transceiver 106 of FIG. 2 and plugsinto the OSFP host port 110 as shown in FIG. 1. The QSFP to OSFP adapter102 has a cage 312 that encloses a QSFP connector (not visible in FIG.3A, but see FIG. 4) and may partially enclose or protect an OSFP edgeconnector 302 at the front end 310 of the QSFP to OSFP adapter 102. Itshould be appreciated that cage 312 may be referred to as a case, frame,main body, housing, shell, enclosure, box, etc. A latch 314 is operatedby a release handle 304 at the back end 308 of the QSFP to OSFP adapter102. The release handle 304 is shown in the latch closed position. Inone embodiment, the latch 314 retains the QSFP to OSFP adapter 102 in anOSFP host port, and can be released by opening the release handle 304(see FIG. 3B). A QSFP port 306 at the back end 308 of the QSFP to OSFPadapter 102 is dimensioned to receive a QSFP transceiver 106.

FIG. 3B is a perspective view of the QSFP to OSFP adapter of FIG. 3,with a release in the open position. The release handle 304 is pivoteddown and pulled back, which pulls the latch 314 back and releases theQSFP to OSFP adapter 102, e.g., from an OSFP port 110. Having a latch314 allows the QSFP to OSFP adapter 102 to remain securely seated in anOSFP port 110 with the latch 314 engaged, while inserting or removing aQSFP transceiver 106 to or from the QSFP port 306 of the QSFP to OSFPadapter 102.

FIG. 4 is a conceptual cross-section view, showing how the QSFPtransceiver 106 fits into and within the QSFP to OSFP adapter 102, andthe QSFP to OSFP adapter 102 fits into and within the OSFP host 104. Acable 402, which could be optical or copper and include one or morecables, according to capabilities or requirements of a particular QSFPtransceiver 106, is connected to the back end 208 of the QSFPtransceiver 106 for handling high-speed communication of the QSFPtransceiver 106 (and the OSFP host 104) to and from a remote host at theother end of the cable 402. In some embodiments, e.g., as shown in FIGS.3A and 3B with a latch and release mechanism, the QSFP to OSFP adapter102 is first inserted into the OSFP host port 110 of the OSFP host 104,and then the QSFP transceiver 106 is inserted into the QSFP host port306 of the QSFP to OSFP adapter 102. In further embodiments, the OSFPtransceiver 106 can be first inserted into the back end 308 of the QSFPto OSFP adapter 102, and then the front end 310 of the QSFP to OSFPadapter 102 is inserted into the OSFP host 104. In still furtherembodiments, either order suffices.

Still referring to FIG. 4, the QSFP edge connector 404 at the front end206 of the QSFP transceiver 106 mates to the QSFP host connector 406within the QSFP port 306 of the QSFP to OSFP adapter 102, with the QSFPtransceiver 106 embedded in the QSFP to OSFP adapter 102. The OSFP edgeconnector 302 at the front end 310 of the QSFP to OSFP adapter 102 matesto the OSFP host connector 408 within the OSFP port 110 of the OSFP host104. Electronic circuitry 410 within the QSFP to OSFP adapter 102 makessignals of the QSFP transceiver 106 and the OSFP host 104 compatible. Inone embodiment, the electronic circuitry 410 includes a PLD(programmable logic device and an EEPROM (electrically erasableprogrammable read-only memory) that bridge signals of the QSFPtransceiver 106 and signals of the OSFP host 104. Components of theelectronic circuitry 410 are mounted to a circuit board, as describedwith reference to FIGS. 6, 7A and 7B, in various embodiments.

FIG. 5 is a perspective view of the QSFP transceiver 106 of FIG. 2inserted into the QSFP to OSFP adapter 102 of FIG. 3A. In thisembodiment, more than half of the main body of the QSFP transceiver 106(excluding the handle 204, in embodiments that have one) is inside ofthe QSFP to OSFP adapter 102, however this is not meant to be limitingas more or less of the main body of the QSFP transceiver may be insideof the QSFP to OSFP adapter. In one embodiment, the QSFP transceiver 106and QSFP to OSFP adapter 102 can be assembled together, then insertedinto the OSFP port 110 of the OSFP host 104, with the latch 314 clickinginto place and securing the QSFP to OSFP adapter 102 in the OSFP host104. In some embodiments, since the release handle 304 of the QSFP toOSFP adapter 102 is kept in the latch closed position by the insertedQSFP transceiver 106, the QSFP to OSFP adapter 102 can only be removedfrom the OSFP host 104 after the QSFP transceiver 106 is removed fromthe QSFP to OSFP adapter 102, freeing up the release handle 304 to moveto the latch opened position shown in FIG. 3B.

FIG. 6 is a cutaway view of an embodiment of the QSFP to OSFP adapter102, showing a flex circuit board 602 flexing to align a QSFP hostconnector 406 and an OSFP edge connector 302. In this embodiment, theOSFP edge connector 302 is electrically connected to the flexiblecircuit board 602 (e.g., by soldering) at one end of the flexiblecircuit board 602, and the QSFP host connector 406 is electricallyconnected to the other end of the flexible circuit board 602 (e.g., bysoldering). Electronic circuits 410 could also be assembled to theflexible circuit board 602 at various locations, thereby enablingelectrical connection to pads of the OSFP edge connector 302 and theQSFP host connector 406. As a result of the flexing of the flex circuitboard 602, the OSFP edge connector 302 is at one height (or elevation),and the mounting location for the QSFP host connector 406 to attach tothe flex circuit board 602 is at another height (or elevation), thusaligning these components in accordance with height (or otherdimensional) requirements of respective standards. Alternatives to theflex circuit board 602 are possible as described below.

FIG. 7A is a conceptual cross-section view with exaggerated proportionsshowing a stepped or milled circuit board 702 with a step that aligns aQSFP host connector 406 and an OSFP edge connector 302, as analternative to the flex circuit board 602 of FIG. 6. Electronic circuits410 are mounted to the circuit board 702 and connect to the OSFP edgeconnector 302 and the QSFP host connector 406 using circuit board tracesand vias 708. The circuit board 702 has two steps 704, 706, which couldbe created by milling (see FIGS. 8 and 9) or by building up variousshaped pieces in a lamination. Varied heights afforded by one or moresteps 704, 706 of the circuit board 702 allow the OSFP edge connector302, which is part of the circuit board 702 at one height, and the QSFPhost connector 406, which is mounted to the circuit board 702 atanother, different height (or elevation), to be aligned in accordancewith height or other dimensional requirements of respective standards.That is, the stepped or milled circuit board 702 allows the OSFP edgeconnector 302, formed as the card edge of the circuit board 702, toengage with the OSFP host connector 408 in the OSFP host 104 and stepsdown to support the correct height for the QSFP connector 406 mounted tothe circuit board 702 to engage the QSFP edge connector 404 of the QSFPtransceiver 106.

FIG. 7B is a conceptual cross-section view with exaggerated proportionsshowing a stepped or milled circuit board 710 that aligns a QSFP hostconnector 406 and an OSFP edge connector 302, as a further embodimentalternative to the flex circuit board 602 of FIG. 6. As in theembodiment shown in FIG. 7A, electronic circuits 410 are mounted to thecircuit board 710, and varied heights afforded by one or more steps 704,706 align the OSFP edge connector 302, which is part of the circuitboard 710, and the QSFP host connector 406. In the embodiment in FIG.7B, a central portion of the circuit board 710 is thicker than theembodiment shown in FIG. 7B, and the OSFP edge connector 302 projectsfrom a portion of the circuit board 710 that has been stepped down aswell as stepped up, or has both faces of the circuit board milled.Electronic circuits 410 electrically connect to the OSFP edge connector302 and the QSFP host connector 406 using circuit board traces and vias708.

FIG. 8 is a cross-section view with exaggerated proportions of a circuitboard with one or more dummy cores, prepared for milling. The circuitboard is made of multiple layers 802, laminated together. Gold plating810 on opposed faces of a sub core 808 of the circuit board areaccompanied by dummy cores 806 made of a material that does not bond tocores 812, the sub core 808, or the gold plating 810. Thus, during amilling process dummy cores 806 will drop off to expose sub core 808 asillustrated in FIG. 9. Pre-preg 804, i.e., pre-impregnated, e.g. withthe epoxy or other matrix material, or other suitable material utilizedfor circuit board manufacturing, is used in other regions of thelayer(s) outside of where the dummy core 806 and gold plating 810 areplaced.

FIG. 9 is a cross-section view with exaggerated proportions of thecircuit board of FIG. 8 after milling, as applicable to embodiments of astepped or milled circuit board. The milling process removes, inspecified regions 904, layers 802 including L1, core 812 and L2 on oneside of the circuit board, and L10, core 812 and L9 on the other side ofthe circuit board, above and below the gold plating 810 and dummy cores806. The dummy cores 806 can be mechanically or chemically removed insome embodiments. Further milling or sawing removes further layers,including L3, sub core 808 (e.g., layers L4-L7, not shown) and L3 in aspecified region 906. This process leaves the gold plating 810 intact inthe top and bottom regions 904, so that the projection in the regions904 becomes an edge connector, for example. Further gold plating 810 onother layers (e.g., L1 and L10) could be made for other electricalcontacts. Variations on the example and process depicted in FIG. 9 canreadily produce the embodiments of the stepped or milled circuit boardshown in FIGS. 7A and 7B.

FIG. 10 is a flow diagram of a method for using a communication adapter,which can be practiced using embodiments of the QSFP to OSFP adapterdisclosed herein. In an action 1002, the QSFP to OSFP adapter is pluggedinto or connected to the OSFP port in an OSFP host. In some embodiments,this is accompanied by latching the QSFP to OSFP adapter into the OSFPport. In an action 1004, a QSFP transceiver is plugged into or connectedto the QSFP to OSFP adapter. In an action 1006, a cable is plugged intothe QSFP transceiver. Variations of the method include performing theaction 1004 prior to the action 1002 and/or performing the action 1006prior to the action 1002 or the action 1004.

FIG. 11A depicts an alternative solution for adaptation usingspecialized modules. Here, the QSFP transceiver 1102, connected to aremote host 1108, uses optical cable 1106, as does the OSFP transceiver1104, connected to the local host 1110. Each of the QSFP transceiver1102 and the OSFP transceiver 1104 is an optical module pluggablemodule, and accepts optical cable, for example MPO as depicted, or LC.But, the solution of FIG. 11A may not work if the QSFP transceiver 1102and OSFP transceiver 1104 have incompatible optical cable requirements(e.g., one of them accepts LC, the other accepts MPO).

FIG. 11B depicts an alternative solution for adaptation using aspecialized cable 1116. One connector of the cable 1116 is a QSFPconnector 1112, shown connecting to the remote host 1108. The otherconnector of the cable 1116 is an OSFP connector 1114, shown connectingto the local host 1110. The solution of FIG. 11B requires a custom cablewith the connectors. And, to retrofit the existing cables, the solutionrequires removal and replacement of the cable with the new, specializedcable 1116, or retrofitting OSFP connectors 1114 onto cables in thefield. Accordingly, the solution in FIG. 11B is more labor-intensive andmay be impractical in some cases.

FIG. 11C depicts an alternative solution for adaptation using aspecialized adapter 1126 with cable 1128. One connector of the cable1128 is a QSFP host connector 1124, and the other connector of the cable1128 includes an OSFP transceiver 1118. The OSFP transceiver 1118 of thespecialized adapter 1126 plugs into the local host 1110. The QSFP hostconnector 1124 of the specialized adapter 1126 receives a QSFP connector1120 from one end of a cable 1122 connected at the other end to a remotehost 1108, for example by a QSFP connector 1128. The solution in FIG.11C requires extra cable management as compared to the embodimentsdescribed, as shown in FIG. 11D, and is difficult to debug when there isan issue.

FIG. 11D depicts cable management at a host faceplate 1130, using thealternative solution of FIG. 11C. Three of the specialized adapters 1126are shown plugged into the host faceplate 1130. The large amount ofdangling cables and connectors, and each communication path travelingthrough two cables in series with attendant reliability and reflectionissues would need to be addressed in this embodiment.

In comparison to the alternative solutions of FIGS. 11A-11D, the QSFP toOSFP adapter 102 described with reference to FIGS. 1-10 takes a smallamount of space, is easy to use and is cost-effective, without requiringlabor-intensive replacement of cables. The QSFP to OSFP adapter 102reuses existing QSFP transceivers 106 when an OSFP host 104 is installedas an upgrade, and the OSFP host 104 can use OSFP transceivers 108 atthe same time as QSFP transceivers 106. The presence of a flex, steppedor milled circuit board inside the QSFP to OSFP adapter 102 supportsalignment of QSFP transceivers 106 with a range of heights, to the OSFPhost ports 110. The QSFP to OSFP adapter 102 is not specific to aparticular cable.

Detailed illustrative embodiments are disclosed herein. However,specific functional details disclosed herein are merely representativefor purposes of describing embodiments. Embodiments may, however, beembodied in many alternate forms and should not be construed as limitedto only the embodiments set forth herein.

It should be understood that although the terms first, second, etc. maybe used herein to describe various steps or calculations, these steps orcalculations should not be limited by these terms. These terms are onlyused to distinguish one step or calculation from another. For example, afirst calculation could be termed a second calculation, and, similarly,a second step could be termed a first step, without departing from thescope of this disclosure. As used herein, the term “and/or” and the “I”symbol includes any and all combinations of one or more of theassociated listed items.

As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”,“comprising”, “includes”, and/or “including”, when used herein, specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof. Therefore, the terminology usedherein is for the purpose of describing particular embodiments only andis not intended to be limiting.

It should also be noted that in some alternative implementations, thefunctions/acts noted may occur out of the order noted in the figures.For example, two figures shown in succession may in fact be executedsubstantially concurrently or may sometimes be executed in the reverseorder, depending upon the functionality/acts involved.

With the above embodiments in mind, it should be understood that theembodiments might employ various computer-implemented operationsinvolving data stored in computer systems. These operations are thoserequiring physical manipulation of physical quantities. Usually, thoughnot necessarily, these quantities take the form of electrical ormagnetic signals capable of being stored, transferred, combined,compared, and otherwise manipulated. Further, the manipulationsperformed are often referred to in terms, such as producing,identifying, determining, or comparing. Any of the operations describedherein that form part of the embodiments are useful machine operations.The embodiments also relate to a device or an apparatus for performingthese operations. The apparatus can be specially constructed for therequired purpose, or the apparatus can be a general-purpose computerselectively activated or configured by a computer program stored in thecomputer. In particular, various general-purpose machines can be usedwith computer programs written in accordance with the teachings herein,or it may be more convenient to construct a more specialized apparatusto perform the required operations.

A module, an application, a layer, an agent or other method-operableentity could be implemented as hardware, firmware, or a processorexecuting software, or combinations thereof. It should be appreciatedthat, where a software-based embodiment is disclosed herein, thesoftware can be embodied in a physical machine such as a controller. Forexample, a controller could include a first module and a second module.A controller could be configured to perform various actions, e.g., of amethod, an application, a layer or an agent.

Although the method operations were described in a specific order, itshould be understood that other operations may be performed in betweendescribed operations, described operations may be adjusted so that theyoccur at slightly different times or the described operations may bedistributed in a system which allows the occurrence of the processingoperations at various intervals associated with the processing.

Various units, circuits, or other components may be described or claimedas “configured to” perform a task or tasks. In such contexts, the phrase“configured to” is used to connote structure by indicating that theunits/circuits/components include structure (e.g., circuitry) thatperforms the task or tasks during operation. As such, theunit/circuit/component can be said to be configured to perform the taskeven when the specified unit/circuit/component is not currentlyoperational (e.g., is not on). The units/circuits/components used withthe “configured to” language include hardware—for example, circuits,memory storing program instructions executable to implement theoperation, etc. Reciting that a unit/circuit/component is “configuredto” perform one or more tasks is expressly intended not to invoke 35U.S.C. 112, sixth paragraph, for that unit/circuit/component.Additionally, “configured to” can include generic structure (e.g.,generic circuitry) that is manipulated by software and/or firmware(e.g., an FPGA or a general-purpose processor executing software) tooperate in manner that is capable of performing the task(s) at issue.“Configured to” may also include adapting a manufacturing process (e.g.,a semiconductor fabrication facility) to fabricate devices (e.g.,integrated circuits) that are adapted to implement or perform one ormore tasks.

The foregoing description, for the purpose of explanation, has beendescribed with reference to specific embodiments. However, theillustrative discussions above are not intended to be exhaustive or tolimit the invention to the precise forms disclosed. Many modificationsand variations are possible in view of the above teachings. Theembodiments were chosen and described in order to best explain theprinciples of the embodiments and its practical applications, to therebyenable others skilled in the art to best utilize the embodiments andvarious modifications as may be suited to the particular usecontemplated. Accordingly, the present embodiments are to be consideredas illustrative and not restrictive, and the invention is not to belimited to the details given herein, but may be modified within thescope and equivalents of the appended claims.

What is claimed is:
 1. An adapter for a communication transceiver and acommunication host, comprising: a first end having an OSFP (octal smallform factor pluggable) connector for connection to an OSFP host port; asecond end having a QSFP (quad small form factor pluggable) hostconnector for receiving a QSFP connector; and a circuit board, mountedin a housing, having a first height at the first end of the housing anda differing, second height at the second end of the housing to align anOSFP connector to the OSFP host port and align a QSFP host connector tothe QSFP transceiver.
 2. The adapter of claim 1, wherein the circuitboard includes a flex circuit board connected to the OSFP connector andthe QSFP host connector, with the flex circuit board flexed to align theQSFP host connector and the OSFP connector.
 3. The adapter of claim 1,wherein the circuit board includes a milled circuit board connected tothe QSFP host connector and the milled circuit board having the OSFPconnector at the first end of a main body, with the milled circuit boardhaving more than one thickness or height arranged to align the QSFP hostconnector and the OSFP connector.
 4. The adapter of claim 1, wherein thecircuit board is disposed within a main body and the main body isdimensioned to embed the QSFP transceiver into the adapter.
 5. Theadapter of claim 1, further comprising: at least one additional circuitboard in a main body of the adapter, the at least one additional circuitboard having a PLD (programmable logic device) and an EEPROM(electrically erasable programmable read-only memory), configured tomake signals compatible for the QSFP transceiver and the OSFP host. 6.An adapter for a communication transceiver and a communication host,comprising: a circuit board within a housing of the adapter, the circuitboard having an OSFP edge connector located at a first height orelevation of the circuit board and a QSFP host connector located at asecond height or elevation of the circuit board.
 7. The adapter of claim6, wherein the circuit board includes a flex circuit board connected tothe OSFP edge connector and the QSFP host connector, with the flexcircuit board flexed to align the QSFP host connector and the OSFP edgeconnector.
 8. The adapter of claim 6, wherein the circuit board includesa milled circuit board connected to the QSFP host connector and themilled circuit board having the OSFP edge connector at the first end ofa main body, with the milled circuit board having more than onethickness or height arranged to align the QSFP host connector and theOSFP edge connector.
 9. The adapter of claim 6, wherein the circuitboard is disposed within a main body and the main body is dimensioned toembed the QSFP transceiver into the adapter.
 10. The adapter of claim 6,further comprising: at least one additional circuit board in a main bodyof the adapter, the at least one additional circuit board having a PLD(programmable logic device) and an EEPROM (electrically erasableprogrammable read-only memory), configured to make signals compatiblefor the QSFP transceiver and the OSFP host.
 11. The adapter of claim 6,further comprising: a housing having opposed first and second ends, thehousing dimensioned so that, when a QSFP transceiver is received by theQSFP host connector, the QSFP transceiver is embedded in the housing.